Sourcing and kitting
Full bill of material procurement, including long lead and obsolete parts. Counterfeit mitigation consistent with AS5553 and AS6081.
Circuit CardAssembly
Rigid, rigid-flex and flex assemblies built to IPC Class 2 and Class 3, from first article through sustained rate production. Bare board, components, assembly, test and coating come back as one line item.
Overview
Boards that have towork the first time
Circuit cards are where programs get stuck. Long lead components, parts going obsolete mid production, a bare board house in one state and an assembler in another, and a buyer holding it together while the schedule keeps moving.
Our team takes the whole package. Boards come back built, tested, coated and documented, against one purchase order and one point of contact.
Process
From bare boardto tested assembly
Assembly
Surface mount, through hole and mixed technology on rigid, rigid-flex and flex. Leaded or RoHS compliant lines, ESD controlled throughout.
Inspection
Automated optical inspection on production assemblies, X-ray on ball grid array parts, first article documented to AS9102.
Test
In circuit and functional test written to your specification. Fixtures and procedures developed here when a program needs them.
Protection
Conformal coating, potting and encapsulation for assemblies that have to survive vibration, humidity and thermal cycling.
Integration
Delivered loose, or built into harnesses, chassis and complete line replaceable units. Still one purchase order either way.
5Business DaysAfter material clear
Quick Turn
A line reservedfor prototypes
In prototyping, every day counts. An entire surface mount line is dedicated to quick turn builds and nothing else, so a prototype never sits behind a production run waiting for capacity.
When you are ready to validate a new design, our team is ready to build it. After material clear, a prototype assembly can be complete in as fast as five business days, which gives your team the speed to validate, iterate and move to market faster.
Specification
Build parameters
| Board types | Rigid, rigid-flex and flex |
|---|---|
| Technology | Surface mount, through hole and mixed technology |
| Components | Fine pitch, BGA, QFN, QFP and chip passives |
| Workmanship | IPC-A-610 Class 2 and Class 3 |
| Soldering | IPC J-STD-001 |
| Finishing | Conformal coating, potting and encapsulation |
| Volume | Prototype, low rate initial production and full rate |
| Prototype lead time | As fast as 5 business days after material clear, dedicated quick turn SMT line |
| Traceability | Lot and serial level, documentation package on delivery |
Send us the build package
Gerbers, a bill of material and a quantity is enough to start. Our team will come back with what it can take off your plate.